The people rise information: laser marking machine in the right place for environment and installation method

by:cycjet     2020-08-01
Installation environment: 1, because laser marking machines are precision instruments, please avoid install the following sites and the environment; 2, save the temperature range of 0 ° C to + 50 ° C ( No freezing and condensation) ; 3, storage humidity range of 10% to 90% relative humidity environment ( No condensation and condensing) ; 4, temperature jump, condensation, direct sunlight, dust (the Pay particular attention to, because it is easy to cause the decline in output) ; 5, intense vibration and shock or place, poorly ventilated place close to the wall, unstable slope and places where, may produce static electricity, magnetic, noise and other places, near the water, oil, steam, chemicals, corrosive gas, combustible gas, iron powder, dust and other places, are likely to be of metal or wood such as foreign body contamination. Will be different degrees of influence on equipment, and even some will pose a safety hazard. Install set: temperature, humidity, according to the requirements of specification temperature 15 ℃ - 28 ℃, humidity 20% ~ 80%, due to the change of the output of laser with temperature changes, so must be used at the same temperature, the environment, Such as 23 ° C + 2 ° C) ; Installation method: 1, please install the equipment in a stable, or is not affected by vibration; Around 2, the laser unit and controller unit need to be properly ventilated space. 3, yellow, fiber optic cable consists of very thin optical transmission optical fiber laser, because it is easy to rupture and affect the laser performance, please don't absolutely bend it or reduce it to the smallest R ( Radius 150 mm) Or smaller. 4, exhaust using IDL - When 20 t, do not jam vent, to provide enough space around the equipment, in order to properly discharge equipment heat; 5, if the laser marking card printing produce dust, external ventilation device, etc. , should be provided in order to avoid dust accumulation around the device.
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