2018 ultraviolet laser marking machine equipment data for a period of struggle, harvest year, success in 2017, a summary, a review, feel spirits of 2017, over 2017 happy, looking forward to the New Year, meet the happy life of 2018, 2018, we have to work harder, during the period of people up the independent research and development of uv laser marking machine adopts 355 nm ultraviolet laser research and development, the machine USES the third order intracavity frequency doubling technique compared to the infrared laser, 355 ultraviolet laser focused spot is very small, play the effect of mark was interrupted directly by short wavelength laser material molecular chains, large extent reduce the material mechanical deformation, heat change but (
, so it is mainly used for super fine marking, engraving, especially suitable for used in food, medicine packaging material marking, make a microporous material, glass, porcelain high speed divided and complex graphics on silicon wafer cutting and application industry.
Characteristics of ultraviolet laser marking machine 1, ultraviolet laser with minimal focal sp, small heat affected zone and processing, thus it can be for ultra fine marking, rallying the effect is product of choice for customers have higher requirements;
2, ultraviolet laser besides copper quality, suitable for processing of materials more widely;
3, good beam quality, not only the focus spot smaller, can achieve hyperfine markers;
4, the applicable scope is more extensive;
Heat affected zone small, won't produce heating effect, will not produce the material burnt problem;
5, marking speed, high efficiency;
The machine performance is stable, small size, low power consumption advantage;
Uv laser marking machine parameters of ultraviolet laser marking machine equipment application 1.
Suitable for glass, polymer materials surface marking, microporous processing;
Widely used in food, medicine, cosmetics, electrical, polymer materials such as bottles (
Flexible PCB, LCD, TFT marking, scribing cutting, etc. ;
Metal or nonmetal coating removal;
Porous silicon wafers, blind hole processing;